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sfh 5712 hochgenauer umgebungslichtsens or mit i2c bus schnittstelle high accuracy ambient light se nsor with i2c bus interface lead (pb) free produc t - rohs compliant 2010-03-31 1 wesentliche merkmale ? gut an die augenem pfindlichkeit (v ) angepasst ? hohe genauigkeit von 3 - 65.000lx ? i2c bus schnittstelle 100kbit/s; 400kbit/s; 1,0 mbit/s und 3,4 mbit/s ? niedriger temperaturkoeffizient der fotoempfindlichkeit anwendungen fr consumer und mobileger?te ? umgebungslicht messung ? steuerung von displayhinterleuchtungen ? sonnenlicht sensor typ type bestellnummer ordering code digitaler ausgang , e v = 1000lx, (white led) digital out out sfh 5712-2/3 1) 1) nur eine gruppe innerhalb einer verpac kungseinheit (streuung kleiner als 2:1) only one bin within one packing unit (variation lower 2:1) q65110a8485 500-1600 features ? good match to human eye sensitivity (v ) ? high accuracy from 3 - 65,000lx ? i2c bus interface 100kbit/s; 400kbit/s; 1. 0 mbit/s and 3.4 mbit/s ? low temperature coeffici ent of photosensitivity applications for consumer and mobile applications ? ambient light measurement ? control of display backlighting ? sunlight sensor
sfh 5712 2010-03-31 2 application diagram and basic operation proposed size for the pull-up resistor is 560 w basic operation register address command action switch v dd on wait >1ms 0x80 write 03 ambient light sensor in active mode wait >250 ms 0x8c read data read lsb data from ambient light measurement (lsb = least significant byte of 16bit output) 0x8d read data read msb data from ambient light measurement (msb = most significant byte of 16bit output) 0x80 write 00 ambient light sensor in stand-by mode sfh 5712 1 2 4 3 gnd v dd sda scl mcu pull-up pull-up v dd = 2.5v 100nf v io = 1.8v i io sfh 5712 1 2 4 3 gnd v dd sda scl mcu pull-up pull-up v dd = 2.5v 100nf v io = 1.8v sfh 5712 1 2 4 3 gnd v dd sda scl mcu pull-up pull-up pull-up pull-up v dd = 2.5v 100nf v io = 1.8v i io
sfh 5712 2010-03-31 3 addressing for ba sic operation i 2 c interface ? 1.8v io-logic level for sda and scl ? io-pins are open drain type an d logic high level is set wi th external pull-up resistor ?sfh 5712-1/2 operates always as slave, address is 0x29 (7bits). bit 0 is used to change between read (r/w bit =1) and write mode (r/w bit =0).. ? designed for the i 2 c-high speed modes (3.4mbit/s) ? see i 2 c bus specification um10204 from nxp for detailed information ? spikes up to 10 ns are suppressed on sda & scl address 0x29 bit 7 6 5 4 3 2 1 0 address r/w bit default 0 1 0 1 0 0 1 x s address 0x29 w communication from master to sfh 5712 communication from sfh 5712 to master w= master writes r = master reads a = acknowledge lsb = least significant byte register 0x80 a a 0x03 a p s address 0x29 w register 0x8c a a p s address 0x29 r lsb data a na p s address 0x29 w register 0x8d a a p s address 0x29 r msb data a na p s address 0x29 w register 0x80 a a 0x00 a p na= not acknowledge s = start condition p = stop condition msb = most significant byte s address 0x29 w communication from master to sfh 5712 communication from sfh 5712 to master w= master writes r = master reads a = acknowledge lsb = least significant byte register 0x80 a a 0x03 a p s address 0x29 w register 0x8c a a p s address 0x29 r lsb data a na p s address 0x29 w register 0x8d a a p s address 0x29 r msb data a na p s address 0x29 w register 0x80 a a 0x00 a p na= not acknowledge s = start condition p = stop condition msb = most significant byte
sfh 5712 2010-03-31 4 modes off if vdd = 0 or not connected the device is in active. other units may use the i2c bus without any restrictions; i/o pins are in z state. stand-by this is the initial mode after power-up . i dd is below 2.5 a. no measurement is performed. only register 0x80 can be read and written. device can be activated by i 2 c bus communication. active measurements are triggered internally by SFH5712. the measurement repetition rate is 2/s. measurement results can be read from the data register off stand-by active v dd connected v dd = 0v activation deactivation v dd = 0v
sfh 5712 2010-03-31 5 maximum ratings parameter symbol value unit storage temperature t stg ? 40 ? + 85 c supply voltage v dd -0.3 ... +4.5 v i2c - bus voltage v io -0.3 ... +2.5 v electrostatic discharge human body model according to eos/esd-5.1-1993 esd hbm 2 kv electrostatic discharge charge device model according to jedec jesd22-c101d esd cdm 500 v operating conditions parameter symbol value unit min. typ. max. operating temperature t op -15 70 c supply voltage v dd 2.3 3.0 v supply voltage ripple (frequency: 0...100mh z, sinus wave) dv dd 100 mv digital output range out 3 65k counts i2c - bus voltage v io 1.6 2.0 v output current ?low? 1) 1) fast mode plus: requirement of iout_low 20ma is not met. i io 3 12 ma
sfh 5712 2010-03-31 6 characteristics parameter symbol value unit min. typ. max. mean current consumption active mode, e v = 0lx, v dd = 2.5 v i dd 145 200 a mean current consumption active mode, e v = 1000lx, v dd = 2.5 v i dd 170 a mean current consumption stand-by mode, v dd = 2.5 v i dd 2.5 a spectral range of sensitivity 20% 400 ... 680 nm wavelength of max. photosensitivity s max 500 nm dimensions of radi ant sensitive area l x w 0.4 x 0.4 mm x mm i2c power up time after vdd ?on? (see appendix 1: flicker reduction and timing) t on 40 s output update time for first measurement (see appendix 1: flicker reduction and timing) t upd 1 1.5 ms resolution of the digital output signal (3lx ....65klx) out 1 count/lx digital output signal variation for v dd = v dd, min to v dd, max ; e v = 1000lx 10 counts deviation from linear output characteristics 1) x = 100-65klx x = 10-100lx x = 3-10lx f lin 5 10 20 % temperature coefficient of the output signal t op = 0...50c t op = -15...0c & 50...70c (1000lx; norm light a) tc ev <0.2 <0.25 %/k flicker reduction at the output (noise frequency: 50...60hz) (see appendix 1: flicker reduction and timing) 13 db
sfh 5712 2010-03-31 7 1) the deviation of the linear output characteristic is referenced to 1000lx and follows the formula : x: sensor illumination level in lux y x : sensor output / measurement value at illumination level x y 1000lx : sensor output / measurement value at illumination level 1000lx f lin y x y 1000lx ------------------ 1000lx x ----------------- - 1 ? ?? ?? 100% = ohf04370 v e / lx lin f -25% -15% 5% -5% 15% 25% 1 10 100 1000 10000 100000
sfh 5712 2010-03-31 8 binning ( t a = 25 c) parameter symbol value unit -2 -3 output signal e v = 1000lx (white led lw 541c) out 500...1000 800...1600 count pin functions pin description v dd supply voltage gnd ground scl i2c bus clock serial i/o terminal (scl) sda i2c bus serial data i/o terminal (sda) figure 1 circuitry ohf04366 a d a/d converter amplifier digital & data register address fixed two wire serial interface photo- diode v dd sda scl gnd i 2 c
sfh 5712 2010-03-31 9 relative spectral sensitivity s rel = f ( ); t a = 25 c output out = f ( e v ); t a = 25 c 400 0 nm % ohf04364 20 40 60 80 100 rel s 10 30 50 70 500 600 700 800 900 1100 v sfh 5712 ohf04363 e v out 0 10 0 10 1 10 2 10 3 10 4 10 5 10 10 1 2 10 3 10 10 4 10 5 lx directional characteristics s rel = f ( ) ; t a = 25 c current consumption i dd = f ( v dd ); t a = 25 c; v dd = 2.5v; active mode ohf04367 0? 20? 40? 60? 80? 100? 120? 0.4 0.6 0.8 1.0 100? 90? 80? 70? 60? 50? 0? 10? 20? 30? 40? 0 0.2 0.4 0.6 0.8 1.0 ? 2.2 140 v v i dd a ohf04365 dd 141 142 143 144 145 146 147 148 150 2.4 2.6 2.8 3 3.2
sfh 5712 2010-03-31 10 appendix 1: flicker reduction and timing sensor is smoothing the output signal by averaging up to 32 single measurements. flicker caused by artificial light sources e.g. from fluorescent lamps usually occurs at 100hz or 120hz. oscillation of the optical input signal will be reduced by 13db at the output for sinus signals. e.g. the sensor output varation will only be 5% of the optical input peak to peak variation from fluore scent light. the flicker reduction is calculated by the relative variation of the optical in put signal (a/a) compared to the sensor output (b/b), see figure 2. figure 2 flicker reduction (average of 32 measurements) to achieve the maximum flicker reduction performance the 32fold aver aged output value should be used. typically 186ms (max. 250ms) after sensor activation the first full averaged signal can be read at the sensor output. the sensor allows to read inte rmediate signal output values prior to 250ms (see figure 3): - single measurement after typ. 1ms - average of 8 measurements after typ 45ms - average of 16 measurements after typ 92ms after the first full averaged measurement value (t>2 50ms) the output will be refreshed automatically twice a second with 32fold averaged values. singl e, 8 and 16fold averaged measurements are only performed after activation of the sensor. ohf04362 time a b sfh 5712 out (b) actual light level 10log [(b/b) / (a/a)] sfh 5712 out optical input (a) and average signal level of
sfh 5712 2010-03-31 11 . figure 3: sfh 5712 averaging and timing appendix 2: digital interface characteristics i nterface and control is accomplished through a two-wi re i2c bus serial interface. the sensor works in multi-master/multi-slave environment, multiple devi ces may be connected to the same bus. the device conforms to i2c interface specification version 3.0 rev. 03 dated 19 june 2007. http://www.standardics.nxp.com/support/doc uments/i2c/pdf/ics.bus.specification.pdf the device implements the i2c write protocol as well as the i2c read (combined mode) protocol. in block read mode (as slave) the device will transmit registers in a cyclic manner until master issues a stop con - dition. e.g. if host uses block read and starts from register ch, slave will return the following sequence of register values: ch, dh, 0h, ah, bh, ch, dh, 0h,.... until host issues a stop condition. the address counter always increases the register address after output of register content. this is also valid, if the device is powered down (stand-by mode) between readings. ohf04371 t typ. 565 ms operation mode max. 750 ms typ. 186 ms max. 250 ms typ. 92 ms max. 125 ms max. 65 ms typ. 45 ms typ. 1 ms max. 1.5 ms typ. 40 s on t t upd delay time until sensor can be addressed 1 st measurement 32 measurements 2 nd avg. of avg. of 8 measurements avg. of 16 measurements avg. of 32 measurements no additional avg. values in between for following readings v dd off output actualisation active stand-by
sfh 5712 2010-03-31 12 part number and revision identification manufacturer identification ambient light measurement data (lsb 8bit) ambient light measurement data (msb 8bit) the result of the ambient light sensor is a 16bit wo rd split in msb and lsb and is stored in two registers. the upper byte data registers can only be read follow ing a read to the corresponding lower byte register. when the lower byte register is read, the upper byte is stored in a temporary register, which is read by a control of ambient light sensor modes r/w-register 0x80 bit 7 6 5 4 3 2 1 0 not used mode of ambient lightsensor default 00000 00 stand-by 00 stand-by 11 active r-register 0x8a bit 7 6 5 4 3 2 1 0 part number id revision id 1000 xxxx (start with 0001) r-register 0x8b bit 7 6 5 4 3 2 1 0 manufacturer identification 0000 0011 r-register 0x8c bit 7 6 5 4 3 2 1 0 lsb data default 00000000 r-register 0x8d bit 7 6 5 4 3 2 1 0 msb data default 00000000
sfh 5712 2010-03-31 13 subsequent read to the upper byte register. the upper register will contain the correct value even if ad - ditional integration cycles end between the reading of the lower and upper registers. example: lsb data and msb data neet to be combined to a 16bit word as follows: lsb data = 0x f0 (1111 0000) msb data = 0x 83 (1000 0011) -> in hex: out = 83 f0 = 33776 counts -> in binary: out= 1000 0011 combined with 1111 0000: 1000 0011 1111 0000 = 33776 counts i2c bus address 7 bit sensor address binary: 0101001 / hex: 29 if the i2c bus master sends a not specified register add ress (e.g. eh see table 1), the device (slave) will not send acknowledge and go to an idle mode and wait for another command.
sfh 5712 2010-03-31 14 package outlines dimensions in mm (inch) pin configuration pin # description 1 v dd 2 gnd 3 sda 4 scl ohpy4195 0.35 (0.014) 0.55 (0.022) 1.1 (0.043) 1.3 (0.051) 1.45 (0.057) 1.25 (0.049) 0.7 (0.028) 0.5 (0.020) 0.6 (0.024) 0.8 (0.031) pin 2 pin 1 pin 3 pin 4 1.8 (0.071) 2.2 (0.087) 2.2 (0.087) 1.8 (0.071) pin 1 pin 4 pin 3 pin 2 photosensitive area 0.16 mm 2 package center bottom view side view top view
sfh 5712 2010-03-31 15 recommended solderpad design dimensions in mm taping ohay4288 180 mm 3000 pcs label reel size: quantity: direction of unreeling direction of unreeling trailer: 160 mm 160 mm gurtende: gurtende: 160mm gurtvorlauf: 400mm trailer: 160mm leader: 400mm
sfh 5712 2010-03-31 16 soldering conditions preconditioning acc. to jedec level 3 reflow soldering profile for lead free soldering (acc. to j-std-020c) published by osram opto semico nductors gmbh leibnizstrasse 4, d-93055 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packi ng material back, if it is sorted. you mu st bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. ohla0687 0 0 t t ?c s 120 s max 50 100 150 200 250 300 ramp up 100 s max 50 100 150 200 250 300 ramp down 6 k/s (max) 3 k/s (max) 25 ?c 30 s max 260 ?c +0 ?c -5 ?c 245 ?c 5 ?c 240 ?c 255 ?c 217 ?c maximum solder profile recommended solder profile 235 ?c -0 ?c +5 ?c minimum solder profile 10 s min
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